Description
EPONAC® 5007 HMP (high melting point), a low molecular weight Bisphenol A based solid epoxy resin, is a “type-1” epoxy with better resistance to sintering during storage. The performances of formulations made from this special grade are the same as those based on EPONAC® 5007.
Application
Suitable for the manufacturing of solvent borne two-component air drying and stoving paints, in the anticorrosion field.
